Northrop Grumman has been tapped as one of the defense firms eligible to receive task orders worth up to $25 billion under the US Defense Microelectronics Activity’s Advanced Technology Support Program V (ATSP V).
The ATSP V is a contracting vehicle aimed at speeding up delivery of American‑made microelectronics into military systems.
Under this program, Northrop Grumman can respond to government requests for proposals within 30 days and aims to complete work from proposal to award in about 80 to 90 days.
The indefinite‑delivery, indefinite‑quantity contract is designed to help the Department of Defense (DoD) and other federal agencies rapidly access engineering solutions ranging from next‑generation semiconductor manufacturing and packaging to emerging materials engineering.
Nine other companies are also joining Northrop Grumman under the ATSP V. These are Battelle Memorial Institute, DRS Network & Imaging Systems, General Dynamics Mission Systems, HII Mission Technologies, L3Harris Technologies, Leidos, Raytheon, the Charles Stark Draper Laboratory, and Vertex Aerospace.
Improving US Microelectronics
The ATSP V contract is the latest in a series of US defense microelectronics awards aimed at strengthening domestic semiconductor capabilities.
Earlier microelectronics supply work dates back even further.
In September 2023, GlobalFoundries won a decade‑long, single‑award contract with a $3.13-billion ceiling from the Defense Microelectronics Activity (DMEA)’s Trusted Access Program Office to provide trusted microelectronic products and processes for defense and federal agencies.
In 2024, IBM secured a DMEA contract with a $576-million ceiling, aimed at enabling an evidence‑based “trusted” enclave in commercial manufacturing to support sensitive semiconductor production for military and national security systems.
