California-based Lantronix Inc. will integrate its Open-Q 5165RB computer chip into Gremsy’s drone platform as part of a collaboration that also involves Teledyne’s thermal imaging tech.
The System-on-Module (SoM) chip brings the Lantronix’s Edge AI solution into the aerial asset, enabling it to process data directly on board in real-time and eliminating the need to relay info back to a cloud.
Combined with Teledyne’s Hadron 640R dual thermal camera, the system transforms Gremsy’s drone into a compact, smarter surveillance platform compliant with government standards.
Read the full story on NextGen Defense: Gremsy, Lantronix, and Teledyne Collab on Drone That Processes Its Own Data
